Polyimide Rod - Material Information

Polyimide (PI) is a high-performance polymer distinguished by its outstanding thermal stability, mechanical strength, and electrical insulation properties. Due to its aromatic molecular backbone and strong imide linkages, PI can operate reliably in environments exceeding 400 °C, making it indispensable in aerospace, electronics, and energy systems. Its low dielectric constant, radiation resistance, and dimensional stability further contribute to its reputation as one of the most durable engineering polymers available.

Material Overview

Polyimides are typically produced via condensation reactions between aromatic dianhydrides and diamines, forming linear or cross-linked chains with strong covalent bonds. Their glass transition temperatures range from 260–360 °C, and they exhibit thermal decomposition temperatures above 500 °C.
Cheng et al. (2025) demonstrated that introducing two-dimensional WS₂ fillers into polyimide matrices improved mechanical properties by 162% in elongation and 12% in electrical breakdown strength due to enhanced interfacial stress transfer and charge trap formation.
Similarly, Li et al. (2025) developed porous lightweight PI films with ultra-high surface insulation strength—up to 55.93 kV—and improved heat dissipation, highlighting PI’s capacity for use in space solar arrays.
In a review by Liu et al. (2024), PI-based dielectrics were found to maintain dielectric constants between 3.0 and 3.5 with high energy storage density (>4 J/cm³) at 300 °C, proving their suitability for next-generation capacitive energy storage. These findings emphasize PI’s balance of flexibility, durability, and high-temperature performance.

Applications and Advantages

Polyimide rods are widely used in precision bearings, electrical insulation, and mechanical components operating under high thermal or radiation stress. Common applications include aerospace insulation films, circuit substrates, sensors, and engine components. The polymer’s inherent chemical resistance and low outgassing also make it ideal for vacuum and space environments. Modified PI composites further enhance these properties, offering tailored dielectric or conductive behavior for emerging energy storage and electronic systems.

Goodfellow Availability

Goodfellow supplies high-purity Polyimide (PI) rods for research and industrial use. Each rod features exceptional mechanical integrity, heat resistance, and electrical insulation. Custom diameters and post-curing treatments are available upon request to meet specialized engineering and aerospace requirements.

Explore Polyimide (PI) and other advanced materials in Goodfellow’s online catalogue: Goodfellow product finder.

References

• Cheng, X., Zhang, W., Wang, C. W., Chen, S., Tang, Z., & Zhang, L. (2025). 2D WS?/Polyimide Composite Films with Enhanced Mechanical Properties, Electrical Breakdown Strength, and Thermal Stability via Optimized Filler–Polymer Interfaces. Journal of Applied Polymer Science. https://doi.org/10.1002/app.57917
• Li, W., Yang, X., Sun, G., Zhang, Y., Liu, H.-J., Qin, X.-G., Song, B.-P., & Zhang, G. (2025). Porous Lightweight Polyimide Films with Ultra-High Surface Insulation Strength and Thermal Insulation for Space Solar Arrays. ACS Applied Materials & Interfaces. https://doi.org/10.1021/acsami.5c16114
• Liu, L., Li, L., Zhang, S., Xu, W., & Wang, Q. (2024). Polyimide-Based Dielectric Materials for High-Temperature Capacitive Energy Storage. Electronic Materials, 5(4), 19. https://doi.org/10.3390/electronicmat5040019
• Wei, W., Zhang, Y., Chen, C.-J., Xu, C., Nie, S., & Zha, J.-W. (2024). Polyimide-Modified Cellulose Insulating Paper with Improved Thermal Stability and Insulation Properties. IEEE Transactions on Dielectrics and Electrical Insulation. https://doi.org/10.1109/TDEI.2024.3414376
• Han, T., & Cavallini, A. (2020). Dielectric Properties and Partial Discharge Endurance of Thermally Aged Nano-Structured Polyimide. IEEE Electrical Insulation Magazine, 36(2), 32–40. https://doi.org/10.1109/MEI.2020.9063562