Tin (Sn) - Lump & Wire - Material Information

Tin (Sn) is a soft, silvery-white metal recognized for its corrosion resistance and excellent soldering characteristics. Known since antiquity, it has played a vital role in metallurgy—from forming bronzes in early civilizations to enabling the modern electronics industry through its use in solders and coatings. Its unique combination of malleability and chemical stability makes it an essential industrial metal.

Material Overview

Tin has a tetragonal crystal structure and a density of 7.31 g/cm³, with a melting point of 231.9 °C. It forms a stable oxide film (SnO₂) on its surface, preventing further oxidation and corrosion in most environments. Tin is amphoteric, meaning it can react with both acids and bases, yet it remains largely inert in water and air at ambient conditions. Alloying with elements such as Ag, Cu, or Zn enhances its mechanical strength and thermal properties, making it suitable for advanced soldering applications. For example, Sn-2.5Ag-0.5Cu alloys exhibit superior corrosion resistance in 3% NaCl solutions compared to traditional Sn-Pb solders, as shown by Montesperelli et al. (2008).

Applications and Advantages

The most widespread use of tin is in the production of lead-free solders for electronics. Tin-based solders, such as Sn-Zn, Sn-Cu-Ni, and Sn-Bi systems, offer good mechanical integrity, high oxidation resistance, and reliable wetting behavior during reflow processes (Zhu & Ding, 2011; Li et al., 2013). Modified Sn-Zn alloys with minor additions of Bi, Al, and Ge improve corrosion resistance and reduce oxidation, maintaining stable electrical performance under high-temperature conditions. Tin coatings—commonly used for steel (tinplate)—provide an economical and environmentally stable barrier against corrosion. Furthermore, modern research highlights how the microstructural tuning of Sn-Zn alloys can reduce corrosion rates from 51.8 to 7.7 mpy and improve hardness, enhancing their durability in industrial environments (Alawy, 2022).

Goodfellow Availability

Goodfellow supplies high-purity tin (Sn) in lump and wire forms for laboratory and industrial use. Each product is designed to meet stringent standards for purity and uniformity. Custom dimensions and specifications are available to suit research, electronic, or metallurgical requirements. Tin from Goodfellow is ideal for applications requiring reliable conductivity, corrosion protection, and mechanical performance.

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References

• Montesperelli, G., Rapone, M., Nanni, F., Travaglia, P., Riani, P., Marazza, R., & Gusmano, G. (2008). Electrochemical and mechanical behaviour of Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn solders. *Materials and Corrosion*, 59(8), 627–633. https://doi.org/10.1002/maco.200804098
• Alawy, F. A. S. M. (2022). Modification structure and their effects on physical properties of tin-based lead-free solder alloys for industrial applications. *International Journal of Scientific Research in Science, Engineering and Technology*, 9(5), 517–523. https://doi.org/10.32628/ijsrset229517