High Thermal Conductivity Silicon Nitride

Goodfellow can now offer high thermal conductivity Silicon Nitride. This material is ideal for specialist applications, and offers several benefits.

• High thermal conductivity of 100W/mK. Which is 4X higher than standard Silicon Nitride. 
• High fracture toughness. 
• Can be polished to a surface roughness of Ra = 0.02um.  
• Excellent mechanical properties.

Typical Properties of this material

Typical Applications

• Power module substrates
• Various types of heat sinks
• LED mounting substrates
• High frequency circuit substrates

Shapes and sizes available

The standard substrate size is 100mm x 100mm with a 0.32mm thickness. Different sizes and thicknesses are available upon request.