Gold/Nickel Alloy - Material Information

Gold–nickel alloys combine the exceptional corrosion resistance and electrical conductivity of gold with the mechanical strength and hardness of nickel. The Au82/Ni18 composition, in particular, is widely recognized for its high-temperature stability and resistance to oxidation, making it a preferred brazing and contact material in electronics, aerospace, and precision engineering applications. Its controlled alloying structure ensures a balance between conductivity, mechanical durability, and environmental resistance.

Material Overview

Gold–nickel alloys are typically single-phase solid solutions, with nickel atoms substituting within gold’s face-centered cubic (FCC) lattice. This substitution enhances hardness and mechanical strength without significantly compromising electrical or thermal conductivity. The Au82/Ni18 alloy exhibits a melting range around 950 °C and a thermal conductivity of approximately 150 W·m⁻¹·K⁻¹. Colbus and Zimmermann (1974) demonstrated that Au–Ni brazing alloys maintain mechanical integrity and corrosion resistance even under subzero and elevated temperature conditions, with strong performance in static, dynamic, and impact loading. More recent studies (Chida et al., 2011) have shown that nanocrystalline–amorphous Au–Ni films offer low resistivity and exceptional corrosion resistance, with phase control enabling high stability up to 300 °C. Gu (2018) expanded on this by developing gold-based alloys with enhanced conductivity, wear resistance, and sulfurization resistance through the addition of trace elements such as platinum and yttrium, further extending the lifespan of Au–Ni components in harsh environments.

Applications and Advantages

Gold–nickel alloys such as Au82/Ni18 are extensively used in high-reliability electrical contacts, brazing alloys, and thermal interface materials. Their resistance to oxidation and corrosion ensures consistent performance in aerospace, power electronics, and high-vacuum applications. The alloy’s superior wetting and bonding characteristics also make it ideal for joining ceramics, steels, and refractory metals in electronic packaging. Au–Ni electrodeposited coatings are commonly employed in microconnectors and semiconductor devices where stable conductivity and mechanical resilience are essential. Furthermore, the alloy’s non-magnetic nature and high reflectivity support its use in precision optical components and specialized sensors.

Goodfellow Availability

Goodfellow provides Gold/Nickel (Au82/Ni18) alloy in various forms and purities, suitable for research, brazing, and advanced manufacturing. All materials are refined for uniform microstructure, high strength, and consistent electrical performance. Custom specifications and geometries can be supplied on request to meet unique design or research requirements.

Explore Gold/Nickel (Au82/Ni18) and other advanced materials in Goodfellow’s online catalogue: Goodfellow product finder.

References

• Colbus, J., & Zimmermann, K. F. (1974). Properties of gold–nickel alloy brazed joints in high-temperature materials. Gold Bulletin, 7(2), 46–54.
• Chida, K., Iwai, R., Tokuhisa, T., Kato, M., Yamaji, N., Okinaka, Y., & Fukasawa, T. (2011). Microstructure and physical properties of nanocrystalline–amorphous mixed-phase Au–Ni alloy films. Journal of the Surface Finishing Society of Japan, 62(8), 397–402.
• Gu, J. (2018). Corrosion-resistant gold-based precise hardware material. Chinese Patent.
• Li, H., Lou, L., Zhang, J., Zheng, B., Ren, J., & Wang, Y. (2015). Thermal corrosion-resistant nickel-based high-temperature alloy with stable structure. Chinese Patent.
• Chin, H. A., Reynolds, P. L., Muron, S. P., Schlichting, K. W., & Benn, R. C. (2014). High-strength, high-thermal-conductivity wrought nickel alloy. US Patent.