3 January 2024
Goodfellow can now offer high thermal conductivity Silicon Nitride. This material is ideal for specialist applications, and offers several benefits.
- High thermal conductivity of 100W/mK. Which is 4X higher than standard Silicon Nitride.
- High fracture toughness.
- Can be polished to a surface roughness of Ra = 0.02um.
- Excellent mechanical properties.
Typical Properties of this material
|
Properties |
Units |
High Thermal Conductivity Silicon Nitride |
|
Density |
g/cm3 |
3.3 |
|
Flexural Strength |
(25°C) (MPa) |
700 |
|
Linear Expansion Coefficient |
(25-800°C) (1/K) |
3x10-6 |
|
Thermal Conductivity |
W/mK |
100 |
|
Youngs Modulus |
GPa |
312 |
|
Poissons Ratio |
|
0.29 |
|
Volume Resistivity |
|
>1013 |
Typical Applications
- Power module substrates
- Various types of heat sinks
- LED mounting substrates
- High frequency circuit substrates
Shapes and sizes available
The standard substrate size is 100mm x 100mm with a 0.32mm thickness. Different sizes and thicknesses are available upon request.